DV-1100 13/12th Gen High Performance Rugged Embedded Computer
13/12th Gen. Intel Core Series High Performance and Rugged Embedded Computer
Key Features:
- Intel® 13/12th Gen. Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
- 1x M.2 Key M Type 2280 Socket for PCIe Gen 4x4 NVMe Storage
- 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
- 1x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
- 1x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
- Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
- Wide operating temperature -40°C to 70°C
- Safety Standard: UL, cUL, CB, IEC, EN 62368-1


The DV-1100 is a compact, high-performance, embedded edge computer that supports 13th/12th generation Intel® processors. Its balance between high-performance computing needs and cost-effectiveness enables enterprises to quickly analyze and process edge data for better decision-making and improved production efficiency and accuracy. The DV-1100 is ideal for smart manufacturing, machine vision, railway computing, and space-constrained applications where stability and reliability are paramount.
Balancing Performance and Cost
The DV-1100 has a compact body and supports a 13th/12th generation Intel® Core™ processor. It provides sufficient computing performance for multitasking and diverse applications while balancing performance and cost.




Compact Size
The DV-1100 measures only 224.1 x 162 x 62mm, making it easy to install anywhere, including in space-constrained applications.
Stunning Transfer and Access Speeds
The DV-1100 has high-speed I/O interfaces, including 2.5G LAN and 10Gbps USB 3.2 Gen2x1. Storage support includes 2.5″ HDD/SSD and high-speed NVMe SSD.




Excellent Extension Design
The DV-1100 has built-in M.2 Key B, M.2 Key E, and M.2 Key M slots for flexible wireless (5G, Wi-Fi, GNSS) and storage selection according to application requirements.
Various Industry Certifications
The DV-1100's rugged design meets various industrial-grade and industrial certifications, such as EMC standards in industrial environments (EN 61000-6-2/4), US military shock vibration standards (MIL-STD-810H), railway computing EN50155 (EN 50121-3-2 only), and more.


Model Name |
DV-1100 |
|
---|---|---|
System |
Processor |
13th Generation Intel® Raptor Lake-S Series CPU: 12th Generation Intel® Alder Lake-S Series CPU: |
Chipset |
• Intel H610E Chipset |
|
Memory |
• 1x DDR5 4800MHz SO-DIMM Socket Supports Un-buffered and non-ECC Type, Up to 32GB |
|
BIOS |
• AMI BIOS |
|
Graphics |
Graphics Engine |
• Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5 • Integrated Intel® UHD Graphics 730: Core™ i3 • Integrated Intel® UHD Graphics 710: Pentium®/Celeron® |
Maximum Display Output |
• Supports Triple Independent Display |
|
DP |
• 1x DisplayPort Connector: 3840 x 2160 @60Hz |
|
VGA |
• 1x VGA Connector: 1920 x 1200 @60Hz |
|
CMI Display |
• 1x CMI Interface for Optional CMI-DP/CMI-HDMI Module Expansion |
|
Audio |
Audio Codec |
• Realtek® ALC888, High Definition Audio |
Line-out |
• 1 x Line-out, Phone Jack 3.5mm |
|
Mic-in |
• 1 x Mic-in, Phone Jack 3.5mm |
|
I/O |
LAN |
• 1x 2.5GbE LAN, RJ45 - Intel® I225 • 1x 1GbE LAN, RJ45 - Intel® I219 |
COM |
• 2x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9 |
|
USB |
• 1x 10Gbps USB3.2 Gen 2x1, Type A • 2x 5Gbps USB3.2 Gen 1x1, Type A • 3x 480Mbps USB2.0, Type A |
|
Storage |
SSD/HDD |
• 1x 2.5" SATA HDD/SSD Bay (SATA 3.0) |
M.2 SSD |
• 1x M.2 SSD Shared by M.2 Key M Type 2280 Socket, Support PCIe Gen 4x4 NVMe SSD or SATA 3.0 SSD • 2x M.2 SSD Shared by M.2 Key B Socket, Support PCIe Gen 3x2 NVMe SSD or SATA 3.0 SSD |
|
Expansion |
M.2 Key E Socket |
• 1x M.2 Key E Type 2230 Socket (PCIe Gen 3x2 / USB2.0), Support Wireless/Intel CNVi Module Expansion |
M.2 Key B Socket |
• 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3x2 / USB3.2 Gen2 x1 / USB2.0 / SATA), Support 5G/Storage/Add-on Card Expansion • 1x M.2 Key B Type 2242 Socket (PCIe Gen 3x2 / USB2.0 / SATA ), Support Storage/Add-on Card Expansion |
|
SIM Socket |
• 1x Front Accessible Dual Nano SIM Socket |
|
CMI (Combined Multiple I/O) Interface |
• 1x CMI Interface for optional CMI-Display Module Expansion • 2x CMI Interface for optional CMI-COM/DIO Module Expansion |
|
CFM (Control Function Module) Interface |
• 1x CFM IGN Interface for optional CFM-IGN Module Expansion |
|
Other Function |
External FAN Connector |
• 1x External FAN Connector, 4-pin Terminal Block (Support Smart Fan by BIOS) |
Clear CMOS Switch |
• 1x Clear CMOS Switch |
|
Reset Button |
• 1x Reset Button |
|
Instant Reboot |
• Support 0.2sec Instant Reboot Technology |
|
Watchdog Timer |
• Software Programmable Supports 256 Levels System Reset |
|
Antenna Hole |
• 5x Antenna Holes |
|
Power |
Power Button |
• 1 x ATX Power On/Off Button |
Power Mode Switch |
• 1 x AT/ATX Mode Switch |
|
Power Input |
• 9 - 48VDC, 3-pin Terminal Block |
|
Remote Power On/Off |
• 1 x Remote Power On/Off, 2-pin Terminal Block |
|
Remote Power LED |
• 1 x Remote Power LED, 2-pin Terminal Block |
|
Max. Power Consumption |
• 35W CPU - OS Idle Mode: 87.34 W - Full Loading: 204.46 W • 65W CPU - OS Idle Mode: 91.18 W - Full Loading: 307.92 W |
|
Inrush Current (Peak) |
• 35W CPU: 4.362 A@24V • 65W CPU: 4.516 A@24V |
|
Physical |
Dimension ( W x D x H ) |
• 224.1 x 162 x 62 mm |
Weight Information |
• 2.52 KG |
|
Mechanical Construction |
• Extruded Aluminum with Heavy Duty Metal |
|
Mounting |
• Wall / DIN-RAIL / VESA Mount |
|
Physical Design |
• Fanless Design • Cableess Design • Jumper-less Design • Unibody Design |
|
Reliability & Protection |
Reverse Power Input Protection |
• Yes |
Over Voltage Protection |
• Protection Range: 51~58V • Protection Type: shut down operating voltage, re-power on at the preset level to recover |
|
Over Current Protection |
• 15A |
|
CMOS Battery Backup |
• SuperCap Integrated for CMOS Battery Maintenance-free Operation |
|
MTBF |
• 413,236 Hours - Database: Telcordia SR-332 Issue3, Method 1, Case 3 |
|
Operating System |
Windows |
• Windows®11, Windows®10 |
Linux |
• Ubuntu 22.04 |
|
Environment |
Operating Temperature |
• 35W TDP Processor: -40°C to 70°C • 65W TDP Processor: -40°C to 55°C (With External Fan Kit) * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling) * With extended temperature peripherals; Ambient with air flow * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
Storage Temperature |
• -40°C to 70°C |
|
Relative Humidity |
• 95% RH @ 70°C (Non-condensing) |
|
Shock |
• MIL-STD-810H |
|
Vibration |
• MIL-STD-810H |
|
EMC |
• CE, UKCA, FCC, ICES-003 Class A • EN IEC 61000-6-4 / EN IEC 61000-6-2 (24VDC Input Only) • EN 50155 (EN 50121-3-2 Only) • E-mark |
|
EMI |
• CISPR 32 Conducted & Radiated: Class A • EN/BS EN 50121-3-2 Conducted & Radiated: Class A • EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A • EN/BS EN 61000-3-3 Voltage fluctuations & flicker • FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A |
|
EMS |
• EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV • EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m • EN/IEC 61000-4-4 EFT: AC Power: 2 kV; DC Power: 2 kV; Signal: 2 kV • EN/IEC 61000-4-5 Surges: AC Power: 2 kV; Signal: 1 kV • EN/IEC 61000-4-6 CS: 10V (**Compliant with the standard when utilizing shielded cable.) • EN/IEC 61000-4-8 PFMF: 50 Hz, 30A • EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 1 cycles at 60 Hz |
|
Safety |
UL, cUL, CB, IEC, EN 62368-1 |
Model No. | Description |
---|---|
DV-1100-R10 | 13/12th Gen. Intel® Core™ Series High Performance and Basic Function Rugged Embedded Computer |