Brand: Cincoze

DX-1200 13/12th Gen Compact Rugged Embedded Computer

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SKU
DX-1200-R10

13/12th Gen. Intel Core Series High Performance and Compact Rugged Embedded Computer

Key Features:

  • Intel® 13/12th Gen Raptor Lake-S/Alder Lake-S Core i9/i7/i5/i3 Processors
  • 2 x DDR5 SO-DIMM Sockets, Supports ECC/non ECC type Memory, Up to 4800MHZ, 64GB
  • Quad Independent Display (HDMI / DP / DVI-I)
  • 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
  • CMI Technology for Optional I/O Module Expansions
  • CFM Technology for Power Ignition Sensing & PoE Function
  • Wide Operating Temperature -40°C to 70°C
  • Safety Standard: UL, cUL, CB, IEC, EN 62368-1
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T

he DX-1200 is a fanless embedded computer that packs extreme performance into a rugged, compact chassis, making it the ideal choice for smart manufacturing, machine vision, and edge AI applications. 13/12th gen Intel® Core™ (Raptor Lake-S / Alder Lake-S) processor (TDP up to 65W) and DDR5 4800 MHz memory provide high-speed computing performance, while additional functions, including rich native I/O and modular expansion design, meet the requirements for a wide range of applications.

Rapid Processing and Inference

The DX-1200 supports 13/12th gen Intel® Core™ i9/i7/i5/i3 (Raptor Lake-S/Alder Lake-S) processors based on the Intel 7 process, with up to 24 cores (8P + 16E) and 32 threads, delivering more than 1.35x the speed of Comet Lake-S platform. The Intel® Xe architecture of the UHD 770 graphics chip boosts GPU image classification inference performance to 2.8× the speed of Comet Lake-S, providing the processing performance needed for AI and edge computing.

High-speed, Safe Memory

Two DDR5 SO-DIMM slots support up to 64GB of 4800MHz memory and include ECC (Error Correction Code) technology, giving the extra stability and reliability needed for industrial automation applications.

Rich and Diverse Expandability

To cater to the widest range of industrial applications, the DX-1200 provides one M.2 Key E slot and two Mini PCIe slots for the addition of WiFi, GNSS, 4G, and Bluetooth. The Mini PCIe slots also support I/O expansion cards, frame grabber cards, and more, to meet different application requirements.

High-speed, Reliable Data Transmission

To improve the transfer rate of videos or large files, the DX-1200 supports up to four high-speed 10Gbps LAN ports. And for application environments that require multiple network connections, the DX-1200 supports up to 8× PoE, providing data and power through the same cable to reduce the difficulty of wiring.

Robust and Reliable

The DX-1200 is built tough, reflected in its industrial-grade protection design and industry certifications in different fields. In addition to features such as wide temperature (-40 - 70°C), wide voltage input (9 - 48 VDC), overvoltage, overcurrent, and ESD protection, it also complies with the US military shock vibration standard MIL-STD-810G. Product safety and reliability are further ensured with internationally recognized UL 62368-1 safety certification. For more secure railway computing, it also passes the EMC EN 50121-3-2 standard in EN 50155 and the EN 45545-2 fire protection standard.

Model Name

DX-1200

System

Processor

13th Generation Intel® Raptor Lake-S Series CPU:
- Intel® Core™ i9-13900E 24 Cores Up to 5.2 GHz, TDP 65W
- Intel® Core™ i7-13700E 16 Cores Up to 5.1 GHz, TDP 65W
- Intel® Core™ i5-13500E 14 Cores Up to 4.6 GHz, TDP 65W
- Intel® Core™ i5-13400E 10 Cores Up to 4.6 Ghz, TDP 65W
- Intel® Core™ i3-13100E 4 Cores Up to 4.4 GHz, TDP 60W
- Intel® Core™ i9-13900TE 24 Cores Up to 5.0 GHz, TDP 35W
- Intel® Core™ i7-13700TE 16 Cores Up to 4.8 GHz, TDP 35W
- Intel® Core™ i5-13500TE 14 Cores Up to 4.5 GHz, TDP 35W
- Intel® Core™ i3-13100TE 4 Cores Up to 4.1 GHz, TDP 35W

12th Generation Intel® Alder Lake-S Series CPU:
- Intel® Core™ i9-12900E 16 Cores Up to 5 GHz, TDP 65W
- Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W
- Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W
- Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W
- Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W
- Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W
- Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W
- Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W
- Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W
- Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W
- Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W
- Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W

Chipset

Intel R680E Chipset

Memory

2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and ECC Type, Up to 64GB

BIOS

AMI BIOS

Graphics

Graphics Engine

Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5

Integrated Intel® UHD Graphics 730: Core™ i3

Integrated Intel® UHD Graphics 710: Pentium®/Celeron®

Maximum Display Output

Supports Quad Independent Display

DVI

1x DVI-I Connector

- VGA: 1920 x 1080 @ 60 Hz

- DVI-D: 1920 x 1200 @ 60 Hz

DP

1x DP Connector: 4096 x 2304 @ 60Hz

* Verified maximum resolution: 3840 x 2160 @ 60Hz

HDMI

1 x HDMI Connector (3840x2160@30Hz)

Audio

Audio Codec

Realtek® ALC888, High Definition Audio

Line-out

1x Line-out, Phone Jack 3.5mm

Mic-in

1x Mic-in, Phone Jack 3.5mm

I/O

LAN

2x 1GbE LAN, RJ45(Supports Wake on LAN, PXE)

- GbE1: Intel® I219

- GbE2: Intel® I210

COM

4x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9

USB

4 x USB 3.2 Gen2x1 (10Gbps), Type A

4 x USB 3.2 Gen1x1 (5Gbps), Type A

Storage

SSD/HDD

2x 2.5" SATA HDD/SSD Bay (SATA 3.0)

mSATA

2x mSATA Socket ( SATA 3.0, shared by Mini-PCIe socket )

RAID

Support RAID 0/1/5/10

Expansion

Mini PCI Express

2x Full-size Mini-PCIe Socket

M.2 E Key Socket

1x M.2 Key E Type 2230 Socket, Support Intel CNVi Module

SIM Socket

1x SIM Socket

CMI (Combined Multiple I/O) Interface

2x High Speed CMI Interface for optional CMI Module Expansion

1x Low Speed CMI Interface for optional CMI Module Expansion

CFM (Control Function Module) Interface

1x CFM IGN Interface for optional CFM-IGN Module Expansion

Other Function

External FAN Connector

1x External FAN Connector, 4-pin Terminal Block

(Support Smart Fan by BIOS)

Clear CMOS Switch

1x Clear CMOS Switch

Reset Button

1x Reset Button

Instant Reboot

Support 0.2sec Instant Reboot Technology

Watchdog Timer

Software Programmable Supports 256 Levels System Reset

Power

Power Button

1 x ATX Power On/Off Button

Power Mode Switch

1 x AT/ATX Mode Switch

Power Input

9 - 48VDC, 3-pin Terminal Block

Remote Power On/Off

1 x Remote Power On/Off, 2-pin Terminal Block

Max. Power Consumption

• 35W CPU

  - OS Idle Mode: 86.14 W

  - Full Loading: 201.17 W

• 65W CPU

  - OS Idle Mode: 99.89 W

  - Full Loading: 274.80 W

Inrush Current (Peak)

• 35W CPU: 4.151 A@24V

• 65W CPU: 4.360 A@24V

Physical

Dimension ( W x D x H )

242 x 173 x 75 mm

Weight Information

3.05 kg

Mechanical Construction

Extruded Aluminum with Heavy Duty Metal

Mounting

Wall / DIN-RAIL / VESA / Side Mount

Physical Design

• Fanless Design

• Cableless Design

• Jumper-less Design

• Unibody Design

Reliability & Protection

Reverse Power Input Protection

Yes

Over Voltage Protection

• Protection Range: 51~58V

• Protection Type: shut down operating voltage, re-power on at the preset level to recover

Over Current Protection

15A

CMOS Battery Backup

SuperCap Integrated for CMOS Battery Maintenance-free Operation

MTBF

394,488 Hours - Database: Telcordia SR-332 Issue3, Method 1, Case 3

Operating System

Windows

Windows®11, Windows®10

Linux

Ubuntu 22.04

Environment

Operating Temperature

• 35W TDP Processor: -40°C to 70°C

• 65W TDP Processor: -40°C to 50°C (With External Fan Kit)

- With extended temperature peripherals; Ambient with air flow

- According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14

Storage Temperature

-40°C to 85°C

Relative Humidity

95% RH @ 70°C (Non-condensing)

Shock

MIL-STD-810G

Vibration

MIL-STD-810G

EMC

• CE, UKCA, FCC, ICES-003 Class A

• EN 50155 (EN 50121-3-2 Only)

• E-Mark

EMI

• CISPR 32 Conducted & Radiated: Class A

• EN/BS EN 50121-3-2 Conducted & Radiated: Class A

• EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A

• EN/BS EN61000-3-3 Voltage fluctuations & flicker

• FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A

EMS

• EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV

• EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m

• EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV

• EN/IEC 61000-4-5 Surges: AC Power: 2 kV

• EN/IEC 61000-4-6 CS: 10V

• EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m

• EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz

Safety

UL, cUL, CB, IEC, EN 62368-1

Fire Protection

EN 45545-2

Model No.

Product Description

DX-1200-R10

13/12th Gen. Intel® Core Series High Performance and Compact Rugged Embedded Computer